Arrangement of silica particles on calcium titanate substrate and its appraisal

Mikihiko Kobayashi; Hiroshi Fudouzi; Mitsuru Egashira; Norio Shinya

doi:10.1117/12.240445

20 May 1996 Arrangement of silica particles on calcium titanate substrate and its appraisal

Mikihiko Kobayashi, Hiroshi Fudouzi, Mitsuru Egashira, Norio Shinya

Proceedings Volume 2722, Smart Structures and Materials 1996: Smart Electronics and MEMS; (1996) https://doi.org/10.1117/12.240445
Event: 1996 Symposium on Smart Structures and Materials, 1996, San Diego, CA, United States

Abstract

A particle assembly using the electron beam was proposed as a process for creation of multi- functional and intelligent materials. Silica (SiO₂) particles of 5.1 micrometers in diameter were arranged along the prescribed pattern on calcium titanate (CaTiO₃) substrates as the first step on the particle assemblage. Latent electrified images were drawn on CaTiO₃ substrates by scanning electron beam. The substrates were dipped in a suspension of SiO₂ (dipping method) or the suspension was dripped on the higher end of the inclined substrates (dripping method). The SiO₂ particles in the suspension were adhered on the latent image by electrostatic force. And the latent image was visualized as a image of particles arrangement. The images of particles arrangement were processed by an image analysis software. It was shown that the adhered particles can be represented by the normal distribution for the transversal direction to the electrified line, and the uniform distribution for the longitudinal direction. The sharpness of the images by particles was appraised by the above distribution model. It became quantitatively clear that the better images were obtained by the dipping method than by the dripping method.

Citation Download Citation

Mikihiko Kobayashi, Hiroshi Fudouzi, Mitsuru Egashira, and Norio Shinya "Arrangement of silica particles on calcium titanate substrate and its appraisal", Proc. SPIE 2722, Smart Structures and Materials 1996: Smart Electronics and MEMS, (20 May 1996); https://doi.org/10.1117/12.240445

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