Paper
21 May 1996 In-line overlay measurements for advanced photolithography
Eric Rouchouze, Daniel Burlet, Jean Marc Dumant
Author Affiliations +
Abstract
A set of analysis tools have been set-up to monitor and diagnose the overlay performances of a multi-stepper fab in a mix-and-match environment. A robust first order modeling and efficient software routines were designed for data transfer and processing. Global statistics, along with trend charts are presented. Process corrections and hardware upgrades can have their effects monitored. Lens-to-lens distortion difference and matching performances can also be evaluated.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eric Rouchouze, Daniel Burlet, and Jean Marc Dumant "In-line overlay measurements for advanced photolithography", Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996); https://doi.org/10.1117/12.240094
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KEYWORDS
Reticles

Semiconducting wafers

Metals

Overlay metrology

Data modeling

Optical alignment

Distortion

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