Paper
15 March 1996 Measuring defect depths by thermal-wave imaging
Lawrence D. Favro, Xiaoyan Han, Pao-Kuang Kuo, Robert L. Thomas
Author Affiliations +
Abstract
We describe a thermal wave technique for making defect depth determinations. Both theory and experiment are presented, and the results are compared. Examples of defects having different lateral dimensions and boundary conditions are given.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lawrence D. Favro, Xiaoyan Han, Pao-Kuang Kuo, and Robert L. Thomas "Measuring defect depths by thermal-wave imaging", Proc. SPIE 2766, Thermosense XVIII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications, (15 March 1996); https://doi.org/10.1117/12.235380
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CITATIONS
Cited by 4 scholarly publications and 3 patents.
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KEYWORDS
Reflection

Manufacturing

Solids

3D image processing

Americium

Diffusion

Nondestructive evaluation

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