Simple technology for fabricating micromechanical 3D structures using electroplating without photoresist mold

Bahram Ghodsian; M. Parameswaran; Marek Syrzycki

doi:10.1117/12.251207

23 September 1996 Simple technology for fabricating micromechanical 3D structures using electroplating without photoresist mold

Bahram Ghodsian, M. Parameswaran, Marek Syrzycki

Author Affiliations +

Proceedings Volume 2879, Micromachining and Microfabrication Process Technology II; (1996) https://doi.org/10.1117/12.251207
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States

Abstract

In this work, we have developed a simple method to fabricate 3D microstructures which eliminates the use of photoresist as molding material. Our method of pattern transfer exploits the anisotropic etch of silicon using EDP or TMAH which allows fabrication of unique structures that would have not been possible by the photoresist-mold method. In this technology the etched silicon substrate itself is used as the mold for subsequent electroplating process to deposit metallic material such as gold, nickel, or iron-nickel alloy. These electroplated microstructures can be easily removed from the silicon mold by choosing an appropriate seed layer which gives poor adhesion to silicon or silicon dioxide substrate. Using this technology metallic microstructures with thicknesses of 300 micrometers has been fabricated to demonstrate the feasibility. We have also fabricated a sharp tip, pyramidal structures suitable for ionization detectors in an integrated micromachined gas chromatographic system.

Citation Download Citation

Bahram Ghodsian, M. Parameswaran, and Marek Syrzycki "Simple technology for fabricating micromechanical 3D structures using electroplating without photoresist mold", Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); https://doi.org/10.1117/12.251207

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