Paper
20 February 1998 Thin film technologies for micro-opto-electro-mechanical system applications
Author Affiliations +
Proceedings Volume 3175, Third International Conference on Thin Film Physics and Applications; (1998) https://doi.org/10.1117/12.300639
Event: Third International Conference on Thin Film Physics and Applications, 1997, Shanghai, China
Abstract
The combination of micro-optics and integrated optics with microelectronics and micromechanics to create a broader class of micro-opto-electro-mechanical system (MOEMS), various thin films and related technologies such as the bulk and surface micromachining and LIG technology for the elementary structures and devices of MEOMS are discussed.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yi-Xin Chen "Thin film technologies for micro-opto-electro-mechanical system applications", Proc. SPIE 3175, Third International Conference on Thin Film Physics and Applications, (20 February 1998); https://doi.org/10.1117/12.300639
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KEYWORDS
Microopto electromechanical systems

Thin films

Integrated optics

Micro optics

Microelectronics

Surface micromachining

Thin film devices

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