Tensile testing of thin-film microstructures

Staffan Greek; Stefan A. I. Johansson

doi:10.1117/12.284534

5 September 1997 Tensile testing of thin-film microstructures

Staffan Greek, Stefan A. I. Johansson

Proceedings Volume 3224, Micromachined Devices and Components III; (1997) https://doi.org/10.1117/12.284534
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States

Abstract

The mechanical properties of thin film microstructures depend on size and shape and on the film manufacturing process. Hence, the test structures that are used to measure mechanical properties should have dimensions of the same order of magnitude as an application structure. The microstructures are easily monitored in a scanning electron microscope (SEM), but to be handled and tested in situ a micromanipulator was developed. The parts of the micromanipulator essential to the tests are two independently moveable tables driven by electric motors. The test structures and a testing unit are mounted on the tables. A testing unit was designed to measure force and displacement with high resolution. The testing unit consists of an arm actuated by a piezoelectric element and equipped with a probe. An optical encoder measures the movement of the arm, while strain gauges measure the force in the arm. Test structures consist typically of a released beam fixed at one end with a ring at the other. The micromanipulator is used to position the probe of the testing unit in the ring. The testing unit then executed a tensile test of the beam. Test structures of polysilicon films produced under various process conditions were used to verify the possibility of measuring Young's modulus with an accuracy of +/- 5 percent, as well as fracture strength.Young's modulus is calculated using the difference in elongation for different beam lengths. The fracture strength of the beams was evaluated with Weibull statistics.

Citation Download Citation

Staffan Greek and Stefan A. I. Johansson "Tensile testing of thin-film microstructures", Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); https://doi.org/10.1117/12.284534

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