Discussion of integrated circuit (IC), multichip module (MCM), and MEMS applications fabricated through MOSIS

Jennifer Peltier; Wes Hansford

doi:10.1117/12.293575

14 November 1997 Discussion of integrated circuit (IC), multichip module (MCM), and MEMS applications fabricated through MOSIS

Jennifer Peltier, Wes Hansford

Author Affiliations +

Proceedings Volume 3242, Smart Electronics and MEMS; (1997) https://doi.org/10.1117/12.293575
Event: Far East and Pacific Rim Symposium on Smart Materials, Structures, and MEMS, 1997, Adelaide, Australia

Abstract

Since inception 16 years ago, the MOSIS Service at the Information Sciences Institute of the University of Southern California has processed over thirty thousand IC Designs. Three years ago, it added access to commercial MultiChip Module (MCM) fabrication through MIDAS. To the list of standard offerings, MOSIS now introduces back end processing of MOSIS custom VLSI circuits for both suspended structure and diaphragm style MEMS. MOSIS presents an array of high- end VLSI technologies from various domestic foundries' standard processes for prototype and small volume quantities. Thus designers can develop low-cost IC's, MCM's and MEMS with a one-stop-shopping commerce style service. MOSIS functions as a 'transparent' third party interface between design and fabrication. The service offers ease of use through supported standard cell libraries and design tools, and with Internet design submission.Sharing the costs of NRE, masks and fabrication provides a low cost environment for users. MOSIS handles the front-end foundry tasks of data preparation and mask fabricate with fixed domestic and international price lists. MOSIS utilizes volume production lines at AMI, HP, Orbit, Vitesse, and MicroModule Systems. This paper discusses what MOSIS offers to the VLSI deign community, various applications fabricated through the service, as well as a conceptual design that draws from the various technologies discussed.

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Jennifer Peltier and Wes Hansford "Discussion of integrated circuit (IC), multichip module (MCM), and MEMS applications fabricated through MOSIS", Proc. SPIE 3242, Smart Electronics and MEMS, (14 November 1997); https://doi.org/10.1117/12.293575

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