Paper
8 June 1998 New particle-inspection system for CMP-planarization-processed metal layers
Masami Ikota, Aritoshi Sugimoto, Yuko Inoue, Junichi Taguchi, Tetsuya Watanabe
Author Affiliations +
Abstract
With the application of chemical mechanical polishing (CMP), particles become the main defect mode among the various modes of defects. Therefore, particle control becomes increasingly important. For the effective particle control, we need to control not only the number of defects but also the size of defects. However, a conventional particle inspection system using laser scattering could not obtain the information of the accurate particle size. We have developed the new system which can obtain the information of accurate particle size by using image processing. The particle size measured by the new system well agrees with the size measured by SEM. With the new system, we can operate the killer particle control effectively.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masami Ikota, Aritoshi Sugimoto, Yuko Inoue, Junichi Taguchi, and Tetsuya Watanabe "New particle-inspection system for CMP-planarization-processed metal layers", Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); https://doi.org/10.1117/12.308742
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Particles

Chemical mechanical planarization

Inspection

Metals

Particle systems

Control systems

Image processing

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