Paper
9 June 1999 Piezoelectrical wire feeding system for micropositioning in bonding machines
Andreas Henke, Martin A. Kuemmel, Joerg Wallaschek
Author Affiliations +
Abstract
In this report a new wire feeding system for fine wire bonding machines and its development is presented. The system is driven by a piezoelectric actuator, which replaces the electromagnetic actuators used in present bonding machines. To minimize the time used to develop the piezoelectric system, several models of the system have been derived and simulations have been made, to optimize the systems performance. After the wire feeding system has been manufactured, experiments have been made to validate the results conceived from the simulations. The performance improvement to the currently used feeding system is discussed.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andreas Henke, Martin A. Kuemmel, and Joerg Wallaschek "Piezoelectrical wire feeding system for micropositioning in bonding machines", Proc. SPIE 3668, Smart Structures and Materials 1999: Smart Structures and Integrated Systems, (9 June 1999); https://doi.org/10.1117/12.350740
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Actuators

Computer aided design

Systems modeling

Control systems

Electromagnetism

Head

Manufacturing

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