Laser welding: providing alignment precision and accuracy to substrate-level packaging

Joe Brown; Nikolaus Maier; Kim Y. Lee; Lorenz Ziegltrum; Jim St Leger

doi:10.1117/12.361217

30 August 1999 Laser welding: providing alignment precision and accuracy to substrate-level packaging

Joe Brown, Nikolaus Maier, Kim Y. Lee, Lorenz Ziegltrum, Jim St Leger

Proceedings Volume 3874, Micromachining and Microfabrication Process Technology V; (1999) https://doi.org/10.1117/12.361217
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

As Micro Systems Technology (MST) expands into new product applications, the present system used to align substrates will have significant impact on yield and product performance. A new technique that ensures the best possible alignment has been developed eliminating misalignment effects from temperature, shock and mechanical movement. This new approach called Laser Welding maintains the precision alignment advantage of setting or freezing substrate position using laser technology to form micro bond spots while the substrates are in the alignment system. The transport tooling is no longer required to maintain alignment with mechanical clamping. This technique will allow device and process designers to scale the requirements for aligned substrate bonding to new levels. At the same time it will dramatically reduce the risk of misalignment from the present transport tooling associated with processes that are at the end of a cumulative build.

Citation Download Citation

Joe Brown, Nikolaus Maier, Kim Y. Lee, Lorenz Ziegltrum, and Jim St Leger "Laser welding: providing alignment precision and accuracy to substrate-level packaging", Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); https://doi.org/10.1117/12.361217

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