Photovoltaic miniarrays assembled using multichip module technology (MCM)

P. R. Ortega; L. Castaner

doi:10.1117/12.382285

10 April 2000 Photovoltaic miniarrays assembled using multichip module technology (MCM)

P. R. Ortega, L. Castaner

Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382285
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France

Abstract

The integration of small arrays of c-Si photovoltaic devices using a flip-chip Multichip Module technology is reported. A number of arrays made of 15 series-connected 2mm² photovoltaic cells have been assembled, achieving a packaging density of 40 chips/cm². Different cell geometries and several fabrication details have been investigated. Preliminary measurements of the dark characteristics are shown with good ideality factor values, thereby indicating that the interconnection of the devices did not jeopardize the properties of the individual cell. More than 6.5 V in open circuit conditions were typically measured, and simulations showed that for monochomatic illumination in the IR region above 60 mA/cm² could be achieved for 100mW/cm² of incoming light. Exposure to commercial IR lamp placed at 4cm distance from the miniarray generated approximately 1mW of power at 6.5V.

Citation Download Citation

P. R. Ortega and L. Castaner "Photovoltaic miniarrays assembled using multichip module technology (MCM)", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); https://doi.org/10.1117/12.382285

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