Laser processing system for microdrilling of printed circuit boards

Junichi Nishimae; Yukio Satoh; Tetsuo Kojima; Tsukasa Fukushima

doi:10.1117/12.405681

6 November 2000 Laser processing system for microdrilling of printed circuit boards

Junichi Nishimae, Yukio Satoh, Tetsuo Kojima, Tsukasa Fukushima

Proceedings Volume 4088, First International Symposium on Laser Precision Microfabrication; (2000) https://doi.org/10.1117/12.405681
Event: First International Symposium on Laser Precision Microfabrication (LPM2000), 2000, Omiya, Saitama, Japan

Abstract

Two laser processing systems for micro drilling of printed circuit boards and/or LSI packages are presented. One is a pulsed CO2 laser system and the other is a LD-pumped THG-YAG laser system, both are now commercially available.

Citation Download Citation

Junichi Nishimae, Yukio Satoh, Tetsuo Kojima, and Tsukasa Fukushima "Laser processing system for microdrilling of printed circuit boards", Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); https://doi.org/10.1117/12.405681

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