Paper
7 September 2000 Multilevel photonic modules for millimeter-wave phased-array antennas
Arthur C. Paolella, Athena Bauerle, Abhay M. Joshi, James G. Wright, Louis A. Coryell
Author Affiliations +
Abstract
Millimeter wave phased array systems have antenna element sizes and spacings similar to MMIC chip dimensions by virtue of the operating wavelength. Designing modules in traditional planar packaing techniques are therefore difficult to implement. An advantageous way to maintain a small module footprint compatible with Ka-Band and high frequency systems is to take advantage of two leading edge technologies, opto- electronic integrated circuits (OEICs) and multilevel packaging technology. Under a Phase II SBIR these technologies are combined to form photonic modules for optically controlled millimeter wave phased array antennas. The proposed module, consisting of an OEIC integrated with a planar antenna array will operate on the 40GHz region. The OEIC consists of an InP based dual-depletion PIN photodetector and distributed amplifier. The multi-level module will be fabricated using an enhanced circuit processing thick film process. Since the modules are batch fabricated using an enhanced circuit processing thick film process. Since the modules are batch fabricated, using standard commercial processes, it has the potential to be low cost while maintaining high performance, impacting both military and commercial communications systems.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Arthur C. Paolella, Athena Bauerle, Abhay M. Joshi, James G. Wright, and Louis A. Coryell "Multilevel photonic modules for millimeter-wave phased-array antennas", Proc. SPIE 4112, Radio Frequency Photonic Devices and Systems, (7 September 2000); https://doi.org/10.1117/12.399380
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KEYWORDS
Antennas

Photonic integrated circuits

Phased arrays

Extremely high frequency

Optical amplifiers

Packaging

Photodetectors

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