Paper
9 October 2000 VCSEL-based optoelectronic multiple-chip modules
Hongda Chen, Kun Liang, Yun Du, Yongzhen Huang, Jun Tiang, Xiaoyu Ma, Rong Han Wu, Shuyong Li, Weilian Guo, Guangjun Xu, Yong Wang
Author Affiliations +
Proceedings Volume 4225, Optical Interconnects for Telecommunication and Data Communications; (2000) https://doi.org/10.1117/12.402681
Event: Optics and Optoelectronic Inspection and Control: Techniques, Applications, and Instruments, 2000, Beijing, China
Abstract
We report on optoelectronic multiple chip modules, consisting of vertical cavity surface emitting laser (VCSEL), photodetector and 1.2 micrometer CMOS electronic circuit. The hybrid integrated components operate at a date rate of 155 Mb/s, which could be used in optical interconnects for multiple computers.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hongda Chen, Kun Liang, Yun Du, Yongzhen Huang, Jun Tiang, Xiaoyu Ma, Rong Han Wu, Shuyong Li, Weilian Guo, Guangjun Xu, and Yong Wang "VCSEL-based optoelectronic multiple-chip modules", Proc. SPIE 4225, Optical Interconnects for Telecommunication and Data Communications, (9 October 2000); https://doi.org/10.1117/12.402681
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KEYWORDS
Vertical cavity surface emitting lasers

Optoelectronics

Electronic circuits

Optical interconnects

Photodetectors

Receivers

Gallium arsenide

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