Paper
8 August 2001 Technological aspects of potentiometric BSC-type microsensor fabrication
Dorota Pijanowska, Katarzyna Wygladacz, Jerzy Jazwinski, Jan M. Lysko, Jan Koszur, Zbigniew Brzozka, Elzbieta Malinowska
Author Affiliations +
Proceedings Volume 4516, Optoelectronic and Electronic Sensors IV; (2001) https://doi.org/10.1117/12.435944
Event: Optoelectronic and Electronic Sensors IV, 2000, Gliwice, Poland
Abstract
The reported back-side contact sensor were fabricated using a standard IC technology. The silver/silver chloride layers were deposited using electrochemical technique. The sensor chips were passivated with silicon nitride layer deposited by LPCVD, which ensure the stability of measurements. Preliminary examination of prepared sensor included the evaluation of their electrical properties and potentiometric response toward chloride. It was found that 19 sensors among 20 exhibited fast and reversible response toward chloride. Near theoretical slopes were obtained over the 10-4- 10-1 M chloride concentration range. The response time was shorter than 10S. The statistical evaluation, the calibration curves and the dynamic response of 20 sensors tested at the same time indicates that the proposed technology ensures preparation of sensor chips in a very reproducible way.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dorota Pijanowska, Katarzyna Wygladacz, Jerzy Jazwinski, Jan M. Lysko, Jan Koszur, Zbigniew Brzozka, and Elzbieta Malinowska "Technological aspects of potentiometric BSC-type microsensor fabrication", Proc. SPIE 4516, Optoelectronic and Electronic Sensors IV, (8 August 2001); https://doi.org/10.1117/12.435944
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Cited by 6 scholarly publications.
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KEYWORDS
Sensors

Silicon

Electrodes

Semiconducting wafers

Calibration

Ions

Silver

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