Plastic integrated optoelectronics

Terho K. Kololuoma; Tomi Haatainen

doi:10.1117/12.469819

10 June 2002 Plastic integrated optoelectronics

Terho K. Kololuoma, Tomi Haatainen

Proceedings Volume 4647, Functional Integration of Opto-Electro-Mechanical Devices and Systems II; (2002) https://doi.org/10.1117/12.469819
Event: Symposium on Integrated Optoelectronic Devices, 2002, San Jose, California, United States

Abstract

Advances in polymer and sol-gel derived hybrid materials have made possible to integrate optical structures including waveguides, sensors and structures used in passive alignment of optical devices on various type of substrates. Particular attention has been given to the fabrication of electro-optical printed circuit boards (EOPCB). Fundamental problems related to printed circuit boards (PCB) are the insufficient surface smoothness of common PCB substrate (FR4) and different coefficients of thermal expansion between the optical material and substrate. In order to resolve these problems sol-gel hybrid materials and cost effective spray-coating method are employed for the fabrication of optical structures on PCB. Surface roughness of the PCB's can be greatly reduced using additional layer under optical core material. This additional layer behaves also as an optical under-cladding layer. Optical properties of these used materials are determined and optical structures fabricated using these directly photopatternable materials are demonstrated.

Citation Download Citation

Terho K. Kololuoma and Tomi Haatainen "Plastic integrated optoelectronics", Proc. SPIE 4647, Functional Integration of Opto-Electro-Mechanical Devices and Systems II, (10 June 2002); https://doi.org/10.1117/12.469819

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