Wafer edge-shot algorithm for wafer scanners

Tsuneyuki Hagiwara; Masato Hamatani; Hideyuki Tashiro; Etsuya Morita; Shinichi Okita; Naoto Kondo

doi:10.1117/12.474628

30 July 2002 Wafer edge-shot algorithm for wafer scanners

Tsuneyuki Hagiwara, Masato Hamatani, Hideyuki Tashiro, Etsuya Morita, Shinichi Okita, Naoto Kondo

Proceedings Volume 4691, Optical Microlithography XV; (2002) https://doi.org/10.1117/12.474628
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

The requirement for the higher resolution is pushing up the NA of the projection lens, so the DOF becomes shallower and the focus budget becomes tight. On the other hand, the requirement for the higher through-put is still demanding. To achieve the best throughput, the alternate scanning exposure sequence is inevitable to current wafer scanners. To realize the alternative scanning exposure, it is necessary to perform precise focusing control even at the partial shot on the wafer edge region. A wafer edge stepwise focusing algorithm is developed. This algorithm utilizes multi-points focusing sensors and dynamically switches the focusing sensors during alternating scan exposure of the partial site on the wafer edge region. Thus the amount of the defocus on the wafer edge region is minimized. The actual performance of the wafer edge stepwise focusing algorithm is discussed. This algorithm can be used with or without pitching motion control of the wafer leveling stage. The influence of the pitching motion control to the focusing performance is also discussed.

Citation Download Citation

Tsuneyuki Hagiwara, Masato Hamatani, Hideyuki Tashiro, Etsuya Morita, Shinichi Okita, and Naoto Kondo "Wafer edge-shot algorithm for wafer scanners", Proc. SPIE 4691, Optical Microlithography XV, (30 July 2002); https://doi.org/10.1117/12.474628

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