High-Q rf passives on organic substrates using a low-cost low-temperature laminate process

Sidharth Dalmia; Seock Hee Lee; Swapan Bhattacharya; Farrokh Ayazi; Madhu Swaminathan

doi:10.1117/12.462868

19 April 2002 High-Q rf passives on organic substrates using a low-cost low-temperature laminate process

Sidharth Dalmia, Seock Hee Lee, Swapan Bhattacharya, Farrokh Ayazi, Madhu Swaminathan

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462868
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

This paper reports on a low-cost low-temperature (2. High-Q inductors and capacitors integrated on low-loss organic package substrates can find numerous RF and microwave SOP applications (such as VCO, IF/RF bandpass filters, LNA, etc., in which IC chips are flip-chip mounted on the package substrate. Integration of passives in organic substrates eliminates the excess cost of assembly, enables miniaturization by allowing for added functionality at the board level, and provides an attractive alternative to higher temperature processes such as ceramic and deposition technologies for high-Q passive implementation.

Citation Download Citation

Sidharth Dalmia, Seock Hee Lee, Swapan Bhattacharya, Farrokh Ayazi, and Madhu Swaminathan "High-Q rf passives on organic substrates using a low-cost low-temperature laminate process", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462868

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