Direct laser writing on porous silicon

Andrea Mario Rossi; Stefano Borini; Luca Boarino; Gianpiero Amato

doi:10.1117/12.468493

15 April 2003 Direct laser writing on porous silicon

Andrea Mario Rossi, Stefano Borini, Luca Boarino, Gianpiero Amato

Author Affiliations +

Proceedings Volume 4941, Laser Micromachining for Optoelectronic Device Fabrication; (2003) https://doi.org/10.1117/12.468493
Event: Photonics Fabrication Europe, 2002, Bruges, Belgium

Abstract

An easy and effective technique for locally oxidize, melt or remove Porous Silicon layers is presented and discussed. The method takes advantage from the very low thermal conductivity of Porous Silicon. With the aid of a focused laser beam, it is possible to reach temperatures of several hundreds °C at the illuminated spot. Results on fabrication of all-porous planar waveguides are presented and discussed. Preliminary results on the application of this technique for fabricating 2D and 3D photonic crystals are reported.

Citation Download Citation

Andrea Mario Rossi, Stefano Borini, Luca Boarino, and Gianpiero Amato "Direct laser writing on porous silicon", Proc. SPIE 4941, Laser Micromachining for Optoelectronic Device Fabrication, (15 April 2003); https://doi.org/10.1117/12.468493

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE