Paper
15 April 2003 Coupling of optoelectronic modules to optical layer in printed circuit boards (PCBs)
Stefan Kopetz, Stefan Lehmacher, Erik Rabe, Andreas Neyer
Author Affiliations +
Proceedings Volume 4942, VCSELs and Optical Interconnects; (2003) https://doi.org/10.1117/12.471914
Event: Photonics Fabrication Europe, 2002, Bruges, Belgium
Abstract
For coupling of light into and out of the optical layer in electric-optical printed circuit boards (PCBs) a scheme for a perpendicular coupling of the light with respect to the waveguide layer is presented. The required 90° light deflection is accomplished by integrated silver-coated 45° micro mirrors which are moulded into polymer substrate together with the waveguide grooves. Exact alignment of the optoelectronic modules with respect to the mirrors is obtained by holes in the waveguide layer and MT pins in the OE-modules.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stefan Kopetz, Stefan Lehmacher, Erik Rabe, and Andreas Neyer "Coupling of optoelectronic modules to optical layer in printed circuit boards (PCBs)", Proc. SPIE 4942, VCSELs and Optical Interconnects, (15 April 2003); https://doi.org/10.1117/12.471914
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CITATIONS
Cited by 2 scholarly publications and 2 patents.
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KEYWORDS
Waveguides

Mirrors

Polymers

Micromirrors

Signal attenuation

Glasses

Integrated optics

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