Paper
17 October 2003 Laser beam soldering: an attractive alternative to conventional soldering technologies
Luedger Bosse, Andreas Koglin, Alexander M. Olowinsky, Volker Kolauch, Michael Nover
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Abstract
Laser beam soldering (LBS) is a non-standard manufacturing process for electronic packaging and interconnection technology today. Due to the actual trend towards complex and cost intensive products, LBS gains more attention for certain applications in this field. For mass production in automotive applications a fully automated and temperature controlled LBS process was developed. The achieved results are discussed with respect to quality, reliability and process efficiency and compared to established micro flame (hydrogen) soldering technology. The development of the LBS process is presented. The process window is optimized using High Speed Video Imaging. Temperature signals are logged by means of pyrometry. The processed parts are evaluated with metallographical assessment of solder joint quality. Especially cross sections reveal the fine grained structure and the shape of the meniscus of the solder joints. The reliability is proven using shear strength tests and thermally induced strain cycles. Conclusively, LBS is a stable, reproducible process for applications requiring controlled and locally restricted heat input. The thermal and mechanical stress is reduced in comparison to conventional techniques.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Luedger Bosse, Andreas Koglin, Alexander M. Olowinsky, Volker Kolauch, and Michael Nover "Laser beam soldering: an attractive alternative to conventional soldering technologies", Proc. SPIE 4977, Photon Processing in Microelectronics and Photonics II, (17 October 2003); https://doi.org/10.1117/12.478609
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Cited by 7 scholarly publications.
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KEYWORDS
Lead

Mirrors

Signal detection

Sensors

Signal processing

Aluminum

Laser welding

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