Electrostatic micromirror fabricated using CMP and anodic bonding

Kunnyun Kim; Wonseok Choi; Kwangbum Park; Joon-Shik Park; Hyo-Derk Park; Hoon Heo

doi:10.1117/12.524676

24 January 2004 Electrostatic micromirror fabricated using CMP and anodic bonding

Kunnyun Kim, Wonseok Choi, Kwangbum Park, Joon-Shik Park, Hyo-Derk Park, Hoon Heo

Proceedings Volume 5346, MOEMS and Miniaturized Systems IV; (2004) https://doi.org/10.1117/12.524676
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States

Abstract

In this paper we present a micromirror fabrication technique without using silicon-on-insulator (SOI) wafers. Torsional electrostatic micromirrors have been fabricated using a combination of chemical mechanical polishing (CMP) process and anodic bonding. The size of fabricated silicon mirror plate was 610×400 μm² and 20 μm thick. The steering electrodes have been fabricated in the dry etched trench on the glass wafer by electroplating process and CMP processing without damage of electrodes during anodic bonding process. The surface roughness of polished silicon micromirror(Ra) was 3.19nm. The single crystal silicon mirrors are electrostatically actuated with parallel bottom electrodes placed 8 μm below the mirror plate, and they could be stably operated in a ±1.1°. The pull-in voltage has been measured as 520 V. The resonant frequency of the fabricated torsion mirror was 47.3 kHz.

Citation Download Citation

Kunnyun Kim, Wonseok Choi, Kwangbum Park, Joon-Shik Park, Hyo-Derk Park, and Hoon Heo "Electrostatic micromirror fabricated using CMP and anodic bonding", Proc. SPIE 5346, MOEMS and Miniaturized Systems IV, (24 January 2004); https://doi.org/10.1117/12.524676

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