Hybrid VCSEL modules with integrated amorphous silicon power monitors

Christopher L. Chua; Francesco Lemmi; Jeng-Ping Lu

doi:10.1117/12.529557

10 June 2004 Hybrid VCSEL modules with integrated amorphous silicon power monitors

Christopher L. Chua, Francesco Lemmi, Jeng-Ping Lu

Proceedings Volume 5358, Photonics Packaging and Integration IV; (2004) https://doi.org/10.1117/12.529557
Event: Integrated Optoelectronic Devices 2004, 2004, San Jose, CA, United States

Abstract

We present a novel optoelectronic package incorporating Vertical-Cavity Surface-Emitting Laser (VCSEL) arrays with built-in power monitors. The power monitor consists of a thin film amorphous silicon p-i-n photodetector that is fabricated on glass. Sets of micro-machined springs for electrical contacting are also fabricated in the same process on the same glass substrate. The springs are made by sputtering, masking, and releasing a stress-engineered conductive thin film. The stress-engineered film is patterned into electrical routing wires whose ends curl up into compliant springs when released from the substrate. Hybrid packages are formed by pressing the micro-machined springs against individual contact pads of the GaAs VCSEL array in a flip-chip assembly process. The power monitor is designed so it lies directly in front of the laser array in the path of the light after module assembly. Although only about 2% of the laser power is absorbed by the sensor, a large signal to noise ratio is retained because of the sensor’s extremely low dark current. Our typical laser output powers of about 1 mW at wavelengths of 811 nm produces power monitor photocurrents of 0.5 to 1 μA, which, for our detectors, correspond to dynamic ranges of over five orders of magnitude.

Citation Download Citation

Christopher L. Chua, Francesco Lemmi, and Jeng-Ping Lu "Hybrid VCSEL modules with integrated amorphous silicon power monitors", Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); https://doi.org/10.1117/12.529557

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