New fabrication method of metallic closed cellular materials containing organic materials

Satoshi Kishimoto; Norio Shinya

doi:10.1117/12.540172

29 July 2004 New fabrication method of metallic closed cellular materials containing organic materials

Satoshi Kishimoto, Norio Shinya

Proceedings Volume 5389, Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology; (2004) https://doi.org/10.1117/12.540172
Event: Smart Structures and Materials, 2004, San Diego, CA, United States

Abstract

New method to fabricate the metallic closed cellular material containing organic materials for the damping systems has been developed. Powder particles of polystyrene coated with a nickel-phosphorus alloy layer using electro-less plating were pressed into pellets and sintered at high temperatures by a furnace and a spark plasma sintering (SPS) system. A metallic closed cellular material containing polystyrene was then fabricated. The physical, mechanical and damping properties of this material were measured. The density of this material is smaller than that of other structural metals. The results of the compressive tests show that this material has the different stress-strain curves among the specimens that have different thickness of the cell walls and the sintering temperatures of the specimens affect the compressive strength of each specimen. Also, it seems that the results of the compressive tests show that this material has high-energy absorption and Young's modulus of this material depends on the thickness of the cell walls. The loss factor of this material was measured and the results show that this material has a large loss factor than that of structural metals. These obtained results emphasize that this metallic closed cellular material can be utilized as energy absorbing material and passive damping material.

Citation Download Citation

Satoshi Kishimoto and Norio Shinya "New fabrication method of metallic closed cellular materials containing organic materials", Proc. SPIE 5389, Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, (29 July 2004); https://doi.org/10.1117/12.540172

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