Optical amplifier made by reporting an Er<sup>3+</sup>/Yb<sup>3+</sup>-codoped glass layer on an ion-exchanged passive glass substrate by wafer bonding

Florent Gardillou; Jean-Emmanuel Broquin

doi:10.1117/12.590464

31 March 2005 Optical amplifier made by reporting an Er³⁺/Yb³⁺-codoped glass layer on an ion-exchanged passive glass substrate by wafer bonding

Florent Gardillou, Jean-Emmanuel Broquin

Author Affiliations +

Proceedings Volume 5728, Integrated Optics: Devices, Materials, and Technologies IX; (2005) https://doi.org/10.1117/12.590464
Event: Integrated Optoelectronic Devices 2005, 2005, San Jose, California, United States

Abstract

Thanks to the maturing of rare-earths highly-doped materials, erbium-doped waveguide amplifiers (EDWAs) present a compact alternative to fibre amplifiers. While ion-exchanged EDWAs implemented on glass substrates provide the best passive characteristics, EDWAs based on thin films technologies offer higher integration degree and amplification efficiencies. This paper proposes the realization of an EDWA in a new configuration which combines all these advantages. Indeed, this optical amplifier consists of an erbium/ytterbium-codoped glass guiding layer reported on an ion-exchanged strip formed on a passive glass substrate. The electromagnetic principle of operation of this hybrid structure is presented. Then, all technological steps of realization are detailed including the report of the active layer by a low-temperature wafer bonding process. Finally, passive and active characterizations allow demonstrating the single mode operation and the amplification efficiency of the hybrid waveguide. Indeed, a high gain coefficient of 3.66±0.25 dB/cm is obtained in the 1.16-cm-long hybrid amplifier.

Citation Download Citation

Florent Gardillou and Jean-Emmanuel Broquin "Optical amplifier made by reporting an Er³⁺/Yb³⁺-codoped glass layer on an ion-exchanged passive glass substrate by wafer bonding", Proc. SPIE 5728, Integrated Optics: Devices, Materials, and Technologies IX, (31 March 2005); https://doi.org/10.1117/12.590464

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