Down-hole seismic survey system with fiber-optic accelerometer sensor array for 3-dimensions vertical seismic profile (3D-VSP)

Qilin Zou; Liwei Wang; Meng Pang; Dongsheng Tu; Min Zhang; Yanbiao Liao

doi:10.1117/12.678230

14 August 2006 Down-hole seismic survey system with fiber-optic accelerometer sensor array for 3-dimensions vertical seismic profile (3D-VSP)

Qilin Zou, Liwei Wang, Meng Pang, Dongsheng Tu, Min Zhang, Yanbiao Liao

Author Affiliations +

Proceedings Volume 6293, Interferometry XIII: Applications; 62930W (2006) https://doi.org/10.1117/12.678230
Event: SPIE Optics + Photonics, 2006, San Diego, California, United States

Abstract

We demonstrated a down-hole seismic survey system that can be applied in three dimensions vertical seismic profile (VSP) detection in petroleum exploration. The results of experiments show that the system has a dynamic measurement range of 80db (ratio of maximum to minimum value) and the total delay for signal collection, process and communication is less than 200ms @ 2k bit sample rates. An array consisting of six fiber-optic accelerometers (receivers) is applied in this system. Each receiver is comprised of three fiber-optic Michelson interferometers. In order to meet the requirements of high precision and real-time measurement, the high-speed DSP chips are employed to realize the algorithms of signal filters and Phase Generated Carrier (PGC) demodulation to obtain the seismic information. Multi-ARM CPUs are introduced into the system to design the fiber-optic accelerometer array controller and the receiver array local bus that are used for real-time data communication between the multi-level receivers and controller. The system interface for traditional ELIS Down-hole Instrument Bus (EDIB) is designed by the use of FPGA so that our system can attach to EDIB and cooperate with other instruments. The design and experiments of the system are given in this paper in detail.

Citation Download Citation

Qilin Zou, Liwei Wang, Meng Pang, Dongsheng Tu, Min Zhang, and Yanbiao Liao "Down-hole seismic survey system with fiber-optic accelerometer sensor array for 3-dimensions vertical seismic profile (3D-VSP)", Proc. SPIE 6293, Interferometry XIII: Applications, 62930W (14 August 2006); https://doi.org/10.1117/12.678230

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