Fabrication of a flexible optical printed circuit board (FO-PCB)

Hyun-Shik Lee; Shin-Mo An; Seung Gol Lee; B. H. O; Se Geon Park; El-Hang Lee

doi:10.1117/12.708704

13 March 2007 Fabrication of a flexible optical printed circuit board (FO-PCB)

Hyun-Shik Lee, Shin-Mo An, Seung Gol Lee, B. H. O, Se Geon Park, El-Hang Lee

Proceedings Volume 6476, Optoelectronic Integrated Circuits IX; 64760M (2007) https://doi.org/10.1117/12.708704
Event: Integrated Optoelectronic Devices 2007, 2007, San Jose, California, United States

Abstract

We report on the fabrication of a flexible optical interconnection module that has been incorporated as a part of an optical printed circuit board (O-PCB). Optical waveguide arrays are fabricated on flexible polyethylen terephthalate (PET) substrate by UV embossing technology. Electrical layers carrying vertical cavity surface emitted laserdiode (VCSEL) and photodiode (PD) array are attached to the optical layer. We measured optical losses of the flexible waveguide arrays bent over various curvatures and characterized transmission performances of the flexible optical PCB (FO-PCB) module. FO-PCB performed high speed optical interconnection between chips over four waveguide channels up to 7.5Gbps on each.

Citation Download Citation

Hyun-Shik Lee, Shin-Mo An, Seung Gol Lee, B. H. O, Se Geon Park, and El-Hang Lee "Fabrication of a flexible optical printed circuit board (FO-PCB)", Proc. SPIE 6476, Optoelectronic Integrated Circuits IX, 64760M (13 March 2007); https://doi.org/10.1117/12.708704

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