Fiber optic interconnect and optoelectronic packaging challenges for future generation avionics

Mark W. Beranek

doi:10.1117/12.709761

14 February 2007 Fiber optic interconnect and optoelectronic packaging challenges for future generation avionics

Mark W. Beranek

Proceedings Volume 6478, Photonics Packaging, Integration, and Interconnects VII; 647809 (2007) https://doi.org/10.1117/12.709761
Event: Integrated Optoelectronic Devices 2007, 2007, San Jose, California, United States

Abstract

Forecasting avionics industry fiber optic interconnect and optoelectronic packaging challenges that lie ahead first requires an assumption that military avionics architectures will evolve from today's centralized/unified concept based on gigabit laser, optical-to-electrical-to-optical switching and optical backplane technology, to a future federated/distributed or centralized/unified concept based on gigabit tunable laser, electro-optical switch and add-drop wavelength division multiplexing (WDM) technology. The requirement to incorporate avionics optical built-in test (BIT) in military avionics fiber optic systems is also assumed to be correct. Taking these assumptions further indicates that future avionics systems engineering will use WDM technology combined with photonic circuit integration and advanced packaging to form the technical basis of the next generation military avionics onboard local area network (LAN). Following this theme, fiber optic cable plants will evolve from today's multimode interconnect solution to a single mode interconnect solution that is highly installable, maintainable, reliable and supportable. Ultimately optical BIT for fiber optic fault detection and isolation will be incorporated as an integral part of a total WDM-based avionics LAN solution. Cost-efficient single mode active and passive photonic component integration and packaging integration is needed to enable reliable operation in the harsh military avionics application environment. Rugged multimode fiber-based transmitters and receivers (transceivers) with in-package optical BIT capability are also needed to enable fully BIT capable single-wavelength fiber optic links on both legacy and future aerospace platforms.

Citation Download Citation

Mark W. Beranek "Fiber optic interconnect and optoelectronic packaging challenges for future generation avionics", Proc. SPIE 6478, Photonics Packaging, Integration, and Interconnects VII, 647809 (14 February 2007); https://doi.org/10.1117/12.709761

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