Immersion-induced defect SEM-based library for fast baseline improvement and excursion

Ilan Englard; Raf Stegen; Erik Van Brederode; Peter Vanoppen; Ingrid Minnaert-Janssen; Frank Duray; Ted der Kinderen; Gazi Tanriseven; Inge Lamers; Mireia Blanco Mantecon; Lior Levin; Eitan Binyamini; Nurit Raccah; Shalev Dror; Eran Valfer; Ofer Rotlevi; Robert Schreutelkamp; Rich Piech

doi:10.1117/12.713466

5 April 2007 Immersion-induced defect SEM-based library for fast baseline improvement and excursion

Ilan Englard, Raf Stegen, Erik Van Brederode, Peter Vanoppen, Ingrid Minnaert-Janssen, Frank Duray, Ted der Kinderen, Gazi Tanriseven, Inge Lamers, Mireia Blanco Mantecon, Lior Levin, Eitan Binyamini, Nurit Raccah, Shalev Dror, Eran Valfer, Ofer Rotlevi, Robert Schreutelkamp, Rich Piech

Author Affiliations +

Proceedings Volume 6518, Metrology, Inspection, and Process Control for Microlithography XXI; 65182G (2007) https://doi.org/10.1117/12.713466
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

Immersion lithography offers great benefit for advanced technology nodes but at the same time poses a great challenge. Along with hyper NA values, which increase the scanner resolution, new types of imaging process related defects emerge. These new defects are related to water, top coating, resist and BARC in the litho process. Root cause analysis of the so-called wet defects (immersion) versus the so-called dry defects (non immersion-related) becomes crucial in any immersion lithography related defect reduction program. Manual and eventually automated classification of defects can be used to analyze the data and monitor baselines. Furthermore, a robust Automatic Defect Classification (ADC) increases productivity and decreases the wafer cycle time. This article outlines a methodological approach for wet and dry defect classification that employs rule-based ADC and enables the generation of an immersion induced defect library for fast baseline improvement and excursion monitoring. The work described in this article has been performed at ASML using Applied Materials' SEMVision G3 FIB automated defect review and analysis tool.

Citation Download Citation

Ilan Englard, Raf Stegen, Erik Van Brederode, Peter Vanoppen, Ingrid Minnaert-Janssen, Frank Duray, Ted der Kinderen, Gazi Tanriseven, Inge Lamers, Mireia Blanco Mantecon, Lior Levin, Eitan Binyamini, Nurit Raccah, Shalev Dror, Eran Valfer, Ofer Rotlevi, Robert Schreutelkamp, and Rich Piech "Immersion-induced defect SEM-based library for fast baseline improvement and excursion", Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65182G (5 April 2007); https://doi.org/10.1117/12.713466

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