Paper
22 March 2007 Characterization of photo-acid redeposition in 193-nm photoresists
Thomas Wallow, Marina Plat, Zhanping Zhang, Brian MacDonald, Joffre Bernard, Jeremias Romero, Bruno La Fontaine, Harry J. Levinson
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Abstract
Time-of-flight secondary-ion mass spectrometry (TOF-SIMS) imaging is demonstrated as a sensitive qualitative method for characterizing surface acid concentrations and accompanying chemical changes at resist surfaces. We show its utility in analyzing the 'chemical flare' phenomenon associated with some chemically amplified photoresists. Two commercial 193 nm photoresists were studied: 'photoresist A' displays lithographic defects linked to chemical flare at die edges; 'photoresist B' does not. TOF-SIMS imaging of the surface of 'photoresist A' following exposure and post-exposure bake (PEB) reveals that die edge defects are well correlated with pronounced emanation of surface acid concentrations from, and blocking group depletion beyond, the die edge. Both photoresists also exhibit longer-range surface acidification that is not well correlated with lithographic effects. A plurality of evidence leads us to infer that photoacid migration from exposed to unexposed regions underlies the lithographic defects observed in 'photoresist A.'
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas Wallow, Marina Plat, Zhanping Zhang, Brian MacDonald, Joffre Bernard, Jeremias Romero, Bruno La Fontaine, and Harry J. Levinson "Characterization of photo-acid redeposition in 193-nm photoresists", Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 65190T (22 March 2007); https://doi.org/10.1117/12.712338
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Cited by 4 scholarly publications.
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KEYWORDS
Photoresist materials

Ions

Lithography

Image resolution

Chemical analysis

Bismuth

Photoresist processing

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