Stress behavior of ball grid array (BGA) studied by dynamic electronic speckle pattern interferometry (DESPI)

Violeta Dimitrova Madjarova; Satoru Toyooka; Hiroyuki Chida; Hirofumi Kadono

doi:10.1117/12.726094

18 June 2007 Stress behavior of ball grid array (BGA) studied by dynamic electronic speckle pattern interferometry (DESPI)

Violeta Dimitrova Madjarova, Satoru Toyooka, Hiroyuki Chida, Hirofumi Kadono

Author Affiliations +

Proceedings Volume 6616, Optical Measurement Systems for Industrial Inspection V; 66162R (2007) https://doi.org/10.1117/12.726094
Event: Optical Metrology, 2007, Munich, Germany

Abstract

In this study, behavior of ball grid arrays (BGA) under external cycling loading was studied. A loading system for inducing cycling stress to BGA was successfully built. Dynamic electronic speckle pattern interferometry (DESPI) with in-plane sensitivity and Hilbert transform for phase analysis was applied. The cycling deformation of one solder ball was measured continuously. Temporal, whole-field deformation on one solder ball was demonstrated.

Citation Download Citation

Violeta Dimitrova Madjarova, Satoru Toyooka, Hiroyuki Chida, and Hirofumi Kadono "Stress behavior of ball grid array (BGA) studied by dynamic electronic speckle pattern interferometry (DESPI)", Proc. SPIE 6616, Optical Measurement Systems for Industrial Inspection V, 66162R (18 June 2007); https://doi.org/10.1117/12.726094

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available