17 µm microbolometer FPA technology at BAE Systems

Richard Blackwell; Daniel Lacroix; Tuyet Bach; Jonathan Ishii; Sandra Hyland; Thomas Dumas; Scott Carpenter; Sherman Chan; Balwinder Sujlana

doi:10.1117/12.819389

6 May 2009 17 μm microbolometer FPA technology at BAE Systems

Richard Blackwell, Daniel Lacroix, Tuyet Bach, Jonathan Ishii, Sandra Hyland, Thomas Dumas, Scott Carpenter, Sherman Chan, Balwinder Sujlana

Author Affiliations +

Proceedings Volume 7298, Infrared Technology and Applications XXXV; 72980P (2009) https://doi.org/10.1117/12.819389
Event: SPIE Defense, Security, and Sensing, 2009, Orlando, Florida, United States

Abstract

BAE Systems has continued to advance its 17 μm pitch LWIR 640 x 480 microbolometer technology with improvements in pixel performance and initial production for several emerging products. In addition, we have developed short time constant variants of our standard pixel design to support applications requiring short thermal time constants. The technology is expanding to include a 1024x768 format megapixel FPA to support higher resolution applications.

Citation Download Citation

Richard Blackwell, Daniel Lacroix, Tuyet Bach, Jonathan Ishii, Sandra Hyland, Thomas Dumas, Scott Carpenter, Sherman Chan, and Balwinder Sujlana "17 μm microbolometer FPA technology at BAE Systems", Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980P (6 May 2009); https://doi.org/10.1117/12.819389

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