Advanced self-aligned DP process development for 22-nm node and beyond

Arisa Hara; Eiichi Nishimura; Masato Kushibiki; Shoichi Yamauchi; Sakurako Natori; Kazuo Yabe; Kenichi Oyama; Hidetami Yaeasghi

doi:10.1117/12.846465

30 March 2010 Advanced self-aligned DP process development for 22-nm node and beyond

Arisa Hara, Eiichi Nishimura, Masato Kushibiki, Shoichi Yamauchi, Sakurako Natori, Kazuo Yabe, Kenichi Oyama, Hidetami Yaeasghi

Author Affiliations +

Proceedings Volume 7639, Advances in Resist Materials and Processing Technology XXVII; 76391T (2010) https://doi.org/10.1117/12.846465
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

Although numerical aperture (NA) has been significantly improved to 1.35 by the introduction of water-bases immersion 193-nm exposure tools, the realistic minimum feature size is still limited to 40 nm even with the help of robust resolution enhancement techniques (RETs). Double patterning processes are techniques that can be used for fabricating etching mask patterns for 32-nm nodes and possibly for 22-nm nodes as well. Although several double patterning processes have been introduced such as LELE[1], LLE[2] and the self-aligned spacer process, LELE and LLE suffer from the need for high overlay accuracy. The self-aligned spacer process[3], meanwhile, has drawn much attention as an effective means of forming repetitive patterns easily. This paper presents results of innovative experiments on the fabrication of 22-nm node patterns by the DP spacer process.

Citation Download Citation

Arisa Hara, Eiichi Nishimura, Masato Kushibiki, Shoichi Yamauchi, Sakurako Natori, Kazuo Yabe, Kenichi Oyama, and Hidetami Yaeasghi "Advanced self-aligned DP process development for 22-nm node and beyond", Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 76391T (30 March 2010); https://doi.org/10.1117/12.846465

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