Optimized Tri-Layer Resist Technique For Volume Production

E. Kawamura; J. Konno; K. Inayoshi; T. Takada

doi:10.1117/12.940339

25 August 1987 Optimized Tri-Layer Resist Technique For Volume Production

E. Kawamura, J. Konno, K. Inayoshi, T. Takada

Proceedings Volume 0771, Advances in Resist Technology and Processing IV; (1987) https://doi.org/10.1117/12.940339
Event: Microlithography Conferences, 1987, Santa Clara, CA, United States

Abstract

Tri-layer resist technique has been developed for volume production of VLIs to achieve 0.8 μm line and space pattern using an NA 0.35 stepper. The 0.8 μm feature process was done mostly by optimizing normality of developer for top-layer resist. Patterned resolution dep-ends strongly on normality of the developer. The lower normality gives much wider latitude to CD control. Possibility of application of tri-layer resist process whose structure consists of top-layer resist, middle-layer silicone resine, and underlayer resist was examined.

Citation Download Citation

E. Kawamura, J. Konno, K. Inayoshi, and T. Takada "Optimized Tri-Layer Resist Technique For Volume Production", Proc. SPIE 0771, Advances in Resist Technology and Processing IV, (25 August 1987); https://doi.org/10.1117/12.940339

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