Sensitive polysulfone based chain scissioning resists for 193nm lithography

Yong Keng Goh; Lan Chen; Anneke Dorgelo; Xie Peng; Neal Lafferty; Bruce Smith; Paul Zimmerman; Warren Montgomery; Idriss Blakey; Andrew K. Whittaker

doi:10.1117/12.881700

15 April 2011 Sensitive polysulfone based chain scissioning resists for 193nm lithography

Yong Keng Goh, Lan Chen, Anneke Dorgelo, Xie Peng, Neal Lafferty, Bruce Smith, Paul Zimmerman, Warren Montgomery, Idriss Blakey, Andrew K. Whittaker

Author Affiliations +

Proceedings Volume 7972, Advances in Resist Materials and Processing Technology XXVIII; 79722E (2011) https://doi.org/10.1117/12.881700
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

Chain scissioning resists do not require addition of photoacid generators to function. Previously reported chain scissioning polysulfone resists were able to achieve enhanced sensitivity by incorporation of absorbing repeat units, but these groups also inhibited the depolymerization reaction, which could further enhance sensitivity. Here we report the development of sensitive polysulfone chain scissioning resists for 193 nm that are able to undergo depolymerization. The effect of depolymerization of LER is also discussed. These polymers underwent CD shrinkage upon overdose, which may be useful for double patterning processes.

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Yong Keng Goh, Lan Chen, Anneke Dorgelo, Xie Peng, Neal Lafferty, Bruce Smith, Paul Zimmerman, Warren Montgomery, Idriss Blakey, and Andrew K. Whittaker "Sensitive polysulfone based chain scissioning resists for 193nm lithography", Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 79722E (15 April 2011); https://doi.org/10.1117/12.881700

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