Analysis and research on the thermal stress of detector affected by packaging accuracy

Linlai Fu

doi:10.1117/12.900184

8 September 2011 Analysis and research on the thermal stress of detector affected by packaging accuracy

Linlai Fu

Proceedings Volume 8193, International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications; 81931S (2011) https://doi.org/10.1117/12.900184
Event: International Symposium on Photoelectronic Detection and Imaging 2011, 2011, Beijing, China

Abstract

Infrared focal plane detector has a multilayer configuration which consists of substrate, chip, readout IC, Indium interconnects, epoxy and electrical lead board, it is packaged layer by layer precisely. Because of the difference in thermal expansion between the layers, with repeated thermal cycling plenty of thermal stress produced by assembling errors will lead result in failure of the interconnects or lead to damage to the detector pixels. In this paper, based on a detector-Dewar assembly, we analyze the thermal stress on the detector by different packaging accuracy level. With the allowable thermal stress, we optimize the processes of the packaging experiment and redesign the fixtures used in the packaging processes to improve assembly accuracy, on this condition, the detector-Dewar assembly assembled satisfies our design requirement, and the thermal stress caused by the cooler is below the range permitted.

Citation Download Citation

Linlai Fu "Analysis and research on the thermal stress of detector affected by packaging accuracy", Proc. SPIE 8193, International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications, 81931S (8 September 2011); https://doi.org/10.1117/12.900184

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