Paper
12 January 2012 Reduction of the 355-nm laser-induced damage initiators by removing the subsurface cracks in fused silica
Minghong Yang, Hongji Qi, Yuanan Zhao, Kui Yi
Author Affiliations +
Proceedings Volume 8206, Pacific Rim Laser Damage 2011: Optical Materials for High Power Lasers; 82061C (2012) https://doi.org/10.1117/12.903037
Event: Pacific Rim Laser Damage Symposium: Optical Materials for High Power Lasers, 2011, Shanghai, China
Abstract
The 355 nm laser-induced damage thresholds (LIDTs) of polished fused silica with and without the residual subsurface cracks were explored. HF based wet etching and magnetorheological finishing was used to remove the subsurface cracks. To isolate the effect of subsurface cracks, chemical leaching was used to eliminate the photoactive impurities in the polishing layer. Results show that the crack number density decreased from~103 to <1cm-2, and the LIDT was improved as high as 2.8-fold with both the subsurface cracks and the polishing layer being removed. Subsurface cracks play a significant role in laser damage at fluencies between 15~31 J/cm2 (355nm, 8ns). HF Etching of the cracks was shown to increase the damage performance as nearly high as that of the samples in which subsurface cracks are well controlled.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Minghong Yang, Hongji Qi, Yuanan Zhao, and Kui Yi "Reduction of the 355-nm laser-induced damage initiators by removing the subsurface cracks in fused silica", Proc. SPIE 8206, Pacific Rim Laser Damage 2011: Optical Materials for High Power Lasers, 82061C (12 January 2012); https://doi.org/10.1117/12.903037
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Polishing

Laser induced damage

Surface finishing

Silica

Etching

Magnetorheological finishing

HF etching

Back to Top