The novel top-coat material for RLS trade-off reduction in EUVL

Ryuji Onishi; Rikimaru Sakamoto; Noriaki Fujitani; Takafumi Endo; Bang-ching Ho

doi:10.1117/12.916341

23 March 2012 The novel top-coat material for RLS trade-off reduction in EUVL

Ryuji Onishi, Rikimaru Sakamoto, Noriaki Fujitani, Takafumi Endo, Bang-ching Ho

Proceedings Volume 8322, Extreme Ultraviolet (EUV) Lithography III; 83222D (2012) https://doi.org/10.1117/12.916341
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

For the next generation lithography (NGL), several technologies have been proposed to achieve the 22nm-node devices and beyond. Extreme ultraviolet (EUV) lithography is one of the candidates for the next generation lithography. In EUV light source development, low power is one of the critical issue because of the low throughput, and another issue is Out of Band (OoB) light existing in EUV light. OoB is concerned to be the cause of deterioration for the lithography performance. In order to avoid this critical issue, we focused on development of the resist top coat material with OoB absorption property as Out of Band Protection Layer (OBPL). We designed this material having high absorbance around 240nm wavelength and high transmittance for EUV light. And this material aimed to improve sensitivity, resolution and LWR performance.

Citation Download Citation

Ryuji Onishi, Rikimaru Sakamoto, Noriaki Fujitani, Takafumi Endo, and Bang-ching Ho "The novel top-coat material for RLS trade-off reduction in EUVL", Proc. SPIE 8322, Extreme Ultraviolet (EUV) Lithography III, 83222D (23 March 2012); https://doi.org/10.1117/12.916341

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