Paper
16 April 2012 Directed self-assembly defectivity assessment. Part II
Chris Bencher, He Yi, Jessica Zhou, Manping Cai, Jeffrey Smith, Liyan Miao, Ofir Montal, Shiran Blitshtein, Alon Lavi, Kfir Dotan, Huixiong Dai, Joy Y. Cheng, Daniel P. Sanders, Melia Tjio, Steven Holmes
Author Affiliations +
Abstract
The main concern for the commercialization of directed self-assembly (DSA) for semiconductor manufacturing continues to be the uncertainty in capability and control of defect density. Our research investigates the defect densities of various DSA process applications in the context of a 300mm wafer fab cleanroom environment; this paper expands substantially on the previously published DSA defectivity study by reporting a defect density process window relative to chemical epitaxial pre-pattern registration lines; as well as investigated DSA based contact hole shrinking and report critical dimension statistics for the phase separated polymers before and after etch, along with positional accuracy measurements and missing via defect density.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chris Bencher, He Yi, Jessica Zhou, Manping Cai, Jeffrey Smith, Liyan Miao, Ofir Montal, Shiran Blitshtein, Alon Lavi, Kfir Dotan, Huixiong Dai, Joy Y. Cheng, Daniel P. Sanders, Melia Tjio, and Steven Holmes "Directed self-assembly defectivity assessment. Part II", Proc. SPIE 8323, Alternative Lithographic Technologies IV, 83230N (16 April 2012); https://doi.org/10.1117/12.917993
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Cited by 47 scholarly publications.
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KEYWORDS
Directed self assembly

Polymethylmethacrylate

Metrology

Image registration

Inspection

Scanning electron microscopy

Semiconducting wafers

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