Paper
1 November 2012 Layer thickness measurement using ultrasonic waves
Paul Schiopu, Carmen Schiopu, Velizar Sorescu, Valentin Feies
Author Affiliations +
Proceedings Volume 8411, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VI; 841119 (2012) https://doi.org/10.1117/12.981557
Event: Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies 2012, 2012, Constanta, Romania
Abstract
In the case of construction works, nondestructive determination of some key parameters is required, parameters that ensure safety and quality of constructions. Among these parameters one can mention: the thickness of the layers of which a road or highway is made; the degree of compaction (especially for the wear layer of a road or highway); the thickness of the bearing elements for a civil or industrial construction; the material type of which the construction is made; the existence of cracks in the case of the bearing elements. From this enumeration of parameters are found to be necessary determinations with ultrasonic waves that can be broadcast (in case both sides of the layer are accessible) or by reflection (in case only one side of the layer is accessible) and there are a large variety of material types that are used, materials having different homogeneity. In the following, the measurement types and methods along with their advantages and disadvantages, as well as some measuring devices will be described.
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Paul Schiopu, Carmen Schiopu, Velizar Sorescu, and Valentin Feies "Layer thickness measurement using ultrasonic waves", Proc. SPIE 8411, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VI, 841119 (1 November 2012); https://doi.org/10.1117/12.981557
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KEYWORDS
Receivers

Transmitters

Reflection

Resonators

Ultrasonics

Microcontrollers

Transducers

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