Analytical modeling of PWAS in-plane and out-of-plane electromechanical impedance spectroscopy (EMIS)

Tuncay Kamas; Bin Lin; Victor Giurgiutiu

doi:10.1117/12.2009249

19 April 2013 Analytical modeling of PWAS in-plane and out-of-plane electromechanical impedance spectroscopy (EMIS)

Tuncay Kamas, Bin Lin, Victor Giurgiutiu

Proceedings Volume 8692, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2013; 869227 (2013) https://doi.org/10.1117/12.2009249
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2013, San Diego, California, United States

Abstract

This paper discusses theoretical analysis of electro-mechanical impedance spectroscopy (EMIS) of piezoelectric wafer active sensor (PWAS). Both free and constrained PWAS EMIS models are developed for in-plane (lengthwise) and outof plane (thickness wise) mode. The paper starts with the general piezoelectric constitutive equations that express the linear relation between stress, strain, electric field and electric displacement. This is followed by the PWAS EMIS models with two assumptions: 1) constant electric displacement in thickness direction (D3) for out-of-plane mode; 2) constant electric field in thickness direction (E3) for in-plane mode. The effects of these assumptions on the free PWAS in-plane and out-of-plane EMIS models are studied and compared. The effects of internal damping of PWAS are considered in the analytical EMIS models. The analytical EMIS models are verified by Coupled Field Finite Element Method (CF-FEM) simulations and by experimental measurements. The extent of the agreement between the analytical and experimental EMIS results is discussed. The paper ends with summary, conclusions, and suggestions for future work.

Citation Download Citation

Tuncay Kamas, Bin Lin, and Victor Giurgiutiu "Analytical modeling of PWAS in-plane and out-of-plane electromechanical impedance spectroscopy (EMIS)", Proc. SPIE 8692, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2013, 869227 (19 April 2013); https://doi.org/10.1117/12.2009249

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available