New robust edge detection methodology for qualifying DSA characteristics by using CD SEM

Satoru Yamaguchi; Kazuhiro Ueda; Takeshi Kato; Norio Hasegawa; Takashi Yamauchi; Shinichiro Kawakami; Makoto Muramatsu; Seiji Nagahara; Takahiro Kitano

doi:10.1117/12.2046136

2 April 2014 New robust edge detection methodology for qualifying DSA characteristics by using CD SEM

Satoru Yamaguchi, Kazuhiro Ueda, Takeshi Kato, Norio Hasegawa, Takashi Yamauchi, Shinichiro Kawakami, Makoto Muramatsu, Seiji Nagahara, Takahiro Kitano

Author Affiliations +

Proceedings Volume 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII; 905029 (2014) https://doi.org/10.1117/12.2046136
Event: SPIE Advanced Lithography, 2014, San Jose, California, United States

Abstract

Grapho-epitaxy based hole shrink process of Directed Self-assembly (DSA) is one of the candidates for less than 30 nm hole pattern fabrication. The guide patterns of grapho-epitaxy are made by using ArF immersion scanner under the condition of near resolution limit to the 193-nm exposure. Hence, guide patterns have measurable level of edge roughness and edge placement errors. Those errors cause serious size errors and placement errors of DSA hole patterns. RED (Robust Edge Detection) is a new measurement function of CD-SEM for qualifying guide pattern shapes and DSA pattern shapes simultaneously. We also propose GBM (Grid Based Metrology) for the measurement of DSA hole's absolute placement error. In this paper, we applied the two methods for qualifying about 20 nm-node’s different polymer film thickness of DSA hole process. The DSA placement error from GBM result and relative DSA placement error obtained by RED are almost same as about 3nm (3sigma). This indicates both RED and GBM methods are correct to measure the DSA process error.

Citation Download Citation

Satoru Yamaguchi, Kazuhiro Ueda, Takeshi Kato, Norio Hasegawa, Takashi Yamauchi, Shinichiro Kawakami, Makoto Muramatsu, Seiji Nagahara, and Takahiro Kitano "New robust edge detection methodology for qualifying DSA characteristics by using CD SEM", Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 905029 (2 April 2014); https://doi.org/10.1117/12.2046136

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available