Paper
27 February 2015 Design and fabrication of 3D high-contrast metastructure THz cage waveguides
Author Affiliations +
Proceedings Volume 9372, High Contrast Metastructures IV; 93720J (2015) https://doi.org/10.1117/12.2079720
Event: SPIE OPTO, 2015, San Francisco, California, United States
Abstract
We have designed new THz metastructure waveguides on Si wafers, aimed for low propagation loss and integration with Si-based integrated circuits. The waveguide has a round cross-sectional hollow-core, surrounded by high reflectioncladding- walls formed by high-contrast metastructure gratings. We developed a new fabrication technique to fabricate such a 3D metastructure cage waveguide structure. The waveguide is built using the entire wafer thickness which involves deep Si etching of periodically spaced holes and using isotropic undercut etching to create a connecting a line of etched spheres in the middle of the wafer to form the waveguide’s hollow core, then deep etch the high-contrast grating through the entire wafer thickness to form the cladding for the waveguide. We have successfully modeled and fabricated such a waveguide structure. The next step is to experimentally test and characterize the waveguide in the THz spectrum range.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gerard Dang, Monica Taysing-Lara, Weimin Zhou, Tianbo Sun, Weijan Yang, and Connie J. Chang-Hasnain "Design and fabrication of 3D high-contrast metastructure THz cage waveguides", Proc. SPIE 9372, High Contrast Metastructures IV, 93720J (27 February 2015); https://doi.org/10.1117/12.2079720
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KEYWORDS
Waveguides

Etching

Semiconducting wafers

Silicon

Terahertz radiation

Scanning electron microscopy

Silica

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