Paper
7 February 2015 Photodiodes integration on a suspended ridge structure VOA using 2-step flip-chip bonding method
Seon Hoon Kim, Tae Un Kim, Hyun Chul Ki, Doo Gun Kim, Hwe Jong Kim, Jung Woon Lim, Dong Yeol Lee, Chul Hee Park
Author Affiliations +
Abstract
In this works, we have demonstrated a VOA integrated with mPDs, based on silica-on-silicon PLC and flip-chip bonding technologies. The suspended ridge structure was applied to reduce the power consumption. It achieves the attenuation of 30dB in open loop operation with the power consumption of below 30W. We have applied two-step flipchip bonding method using passive alignment to perform high density multi-chip integration on a VOA with eutectic AuSn solder bumps. The average bonding strength of the two-step flip-chip bonding method was about 90gf.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Seon Hoon Kim, Tae Un Kim, Hyun Chul Ki, Doo Gun Kim, Hwe Jong Kim, Jung Woon Lim, Dong Yeol Lee, and Chul Hee Park "Photodiodes integration on a suspended ridge structure VOA using 2-step flip-chip bonding method", Proc. SPIE 9389, Next-Generation Optical Communication: Components, Sub-Systems, and Systems IV, 93890S (7 February 2015); https://doi.org/10.1117/12.2080463
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KEYWORDS
Photonic integrated circuits

Silica

Photodiodes

Signal attenuation

Ions

Waveguides

Integrated optics

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