Passive and electro-optic polymer photonics and InP electronics integration

Z. Zhang; V. Katopodis; P. Groumas; A. Konczykowska; J. -Y. Dupuy; A. Beretta; A. Dede; E. Miller; J. H. Choi; P. Harati; F. Jorge; V. Nodjiadjim; R. Dinu; G. Cangini; A. Vannucci; D. Felipe; A. Maese-Novo; N. Keil; H. -G. Bach; Martin Schell; H. Avramopoulos; Ch. Kouloumentas

doi:10.1117/12.2179221

1 May 2015 Passive and electro-optic polymer photonics and InP electronics integration

Z. Zhang, V. Katopodis, P. Groumas, A. Konczykowska, J. -Y. Dupuy, A. Beretta, A. Dede, E. Miller, J. H. Choi, P. Harati, F. Jorge, V. Nodjiadjim, R. Dinu, G. Cangini, A. Vannucci, D. Felipe, A. Maese-Novo, N. Keil, H. -G. Bach, Martin Schell, H. Avramopoulos, Ch. Kouloumentas

Author Affiliations +

Proceedings Volume 9516, Integrated Optics: Physics and Simulations II; 951603 (2015) https://doi.org/10.1117/12.2179221
Event: SPIE Optics + Optoelectronics, 2015, Prague, Czech Republic

Abstract

Hybrid photonic integration allows individual components to be developed at their best-suited material platforms without sacrificing the overall performance. In the past few years a polymer-enabled hybrid integration platform has been established, comprising 1) EO polymers for constructing low-complexity and low-cost Mach-Zehnder modulators (MZMs) with extremely high modulation bandwidth; 2) InP components for light sources, detectors, and high-speed electronics including MUX drivers and DEMUX circuits; 3) Ceramic (AIN) RF board that links the electronic signals within the package. On this platform, advanced optoelectronic modules have been demonstrated, including serial 100 Gb/s [1] and 2x100 Gb/s [2] optical transmitters, but also 400 Gb/s optoelectronic interfaces for intra-data center networks [3]. To expand the device functionalities to an unprecedented level and at the same time improve the integration compatibility with diversified active / passive photonic components, we have added a passive polymer-based photonic board (polyboard) as the 4th material system. This passive polyboard allows for low-cost fabrication of single-mode waveguide networks, enables fast and convenient integration of various thin-film elements (TFEs) to control the light polarization, and provides efficient thermo-optic elements (TOEs) for wavelength tuning, light amplitude regulation and light-path switching.

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Z. Zhang, V. Katopodis, P. Groumas, A. Konczykowska, J. -Y. Dupuy, A. Beretta, A. Dede, E. Miller, J. H. Choi, P. Harati, F. Jorge, V. Nodjiadjim, R. Dinu, G. Cangini, A. Vannucci, D. Felipe, A. Maese-Novo, N. Keil, H. -G. Bach, Martin Schell, H. Avramopoulos, and Ch. Kouloumentas "Passive and electro-optic polymer photonics and InP electronics integration", Proc. SPIE 9516, Integrated Optics: Physics and Simulations II, 951603 (1 May 2015); https://doi.org/10.1117/12.2179221

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