Multiwave hybrid laser processing of micrometer scale features for flexible electronic applications

J. Hillman; Y. Sukhman; D. Miller; M. Oropeza; C. Risser

doi:10.1117/12.2211118

4 March 2016 Multiwave hybrid laser processing of micrometer scale features for flexible electronic applications

J. Hillman, Y. Sukhman, D. Miller, M. Oropeza, C. Risser

Proceedings Volume 9736, Laser-based Micro- and Nanoprocessing X; 97360E (2016) https://doi.org/10.1117/12.2211118
Event: SPIE LASE, 2016, San Francisco, California, United States

Abstract

MultiWave Hybrid^TM laser processing allows two or more laser wavelengths to be combined into a single beam. This technology has been shown to be advantageous for laser cutting composite and laminate materials, where the individual components have different optical or physical properties. In this work we will explore the application of MultiWave Hybrid technology to the fabrication of flexible electronic circuits. The advantages of using multiple laser wavelengths for manufacturing steps, such as opening vias through a Kapton^TM insulator to an underlying copper conductor, will be demonstrated. Several rapid prototyping processes for flexible electronic circuits will be reviewed. These involve selective ablation of conductive materials to pattern an interconnect layer without the need for a costly and time consuming photolithography process. We will also investigate a process for producing laser induced graphene (LIG) from a commercially available polymer substrate.

Citation Download Citation

J. Hillman, Y. Sukhman, D. Miller, M. Oropeza, and C. Risser "Multiwave hybrid laser processing of micrometer scale features for flexible electronic applications", Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 97360E (4 March 2016); https://doi.org/10.1117/12.2211118

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