Presentation
11 November 2022 Advancing spatiochemical metrology via resonant soft x-rays
Author Affiliations +
Abstract
As high-resolution lithography processes edge past the 7 nm node, resist thicknesses continue to shrink and interfacial effects start to dominate performance. This is a challenging metrology problem, as it requires tools that can be used deconstruct the complex interplay of physicochemical nanoscale parameters. This requires the development of multimodal operando characterization capabilities and dedicated analytical techniques to study buried chemical profile and line edge/width roughness in the latent image; to understand the effect of EUV exposure, electron induced chemical reaction in the in situ process; and to reveal how the interfacial chemistry and structure affect the area selective deposition and etching process. We report on our recent results using resonant soft x-ray scattering (RSoXS), whose contrast is enhanced by tuning the incident x-ray energy in order to coincide with chemical inhomogeneities in a sample’s near-edge x-ray absorption fine structure (NEXAFS), which uniquely suited to extract critical information from thin interfacial areas for both top down and bottom up patterning approaches. We will describe how sensitivity can also be extended to study interfacial processes on nanostructured surfaces where the nano patterns can be tailored to enhance the sensitivity of the interfacial region where the we can achieve sub-nm spatial resolution and local chemical sensitivity at the same time. We will present the various experimental configurations and in-situ capabilities being developed to accelerate advances in both general RSoXS metrology and its application to understanding each stage of patterning process.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Cheng Wang "Advancing spatiochemical metrology via resonant soft x-rays", Proc. SPIE PC12292, International Conference on Extreme Ultraviolet Lithography 2022, PC1229204 (11 November 2022); https://doi.org/10.1117/12.2642893
Advertisement
Advertisement
KEYWORDS
X-rays

Metrology

Image processing

Optical lithography

Lithography

Nanostructuring

Photoresist processing

Back to Top