FR4, flex-PCB, and SiP processing performed with speed and quality using high-power visible and UV nanosecond lasers

Terence Hollister; Jim Bovatsek

doi:10.1117/12.3003477

13 March 2024 FR4, flex-PCB, and SiP processing performed with speed and quality using high-power visible and UV nanosecond lasers

Terence Hollister, Jim Bovatsek

Author Affiliations +

Proceedings Volume PC12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX; PC128720H (2024) https://doi.org/10.1117/12.3003477
Event: SPIE LASE, 2024, San Francisco, California, United States

Abstract

The use of lasers for Printed Circuit Board (PCB) manufacturing continues to grow as their cost-per-Watt goes down and power levels go up. Furthermore, many lasers now offer features such as temporal pulse tailoring, which is often beneficial. In this work, we demonstrate several PCB processes using UV and green high-power ns-pulse lasers. In addition to cutting thicker FR4, cutting of system in package (SiP) material is demonstrated, and a process using advanced temporal pulse tailoring with 100 W of UV single-mode laser power for percussion flex-PCB via-drilling is demonstrated for a ~50 μm hole diameter.

Conference Presentation

Citation Download Citation

Terence Hollister and Jim Bovatsek "FR4, flex-PCB, and SiP processing performed with speed and quality using high-power visible and UV nanosecond lasers", Proc. SPIE PC12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX, PC128720H (13 March 2024); https://doi.org/10.1117/12.3003477

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