Presentation
10 April 2024 Understanding plasma etching of grayscale microlenses and multi-height structures for optoelectronic devices
Author Affiliations +
Abstract
The latest promising optoelectronic devices require complex 3D structures. In this study, optical grayscale microlenses and multi-height structures are etched into a polymer layer in a Capacitively Coupled Plasma reactor (CCP). Etching can cause profile deformation and surface roughness, which may affect device performances. A parametric study is conducted to investigate 3D etching mechanisms. We observed strong shape modulation by varying plasma parameters. Increasing chamber pressure, or decreasing High Frequency power, show similar tendencies, going from a rounded to a conic profile. Additional experiments suggest that 3D etching mechanisms rely on complex passivation processes and ion bombardment effects.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Assia Selmouni, Aurélien Tavernier, Api Warsono, Sébastien Bérard-Bergery, and Nicolas Posseme "Understanding plasma etching of grayscale microlenses and multi-height structures for optoelectronic devices", Proc. SPIE PC12958, Advanced Etch Technology and Process Integration for Nanopatterning XIII, (10 April 2024); https://doi.org/10.1117/12.3010137
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KEYWORDS
Plasma etching

Microlens

Optoelectronic devices

Etching

Plasma

Deformation

Passivation

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