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17 March 2023 Laser micro-drilling of glass materials with high-speed laser modulation and real-time monitoring toward data-driven laser processing
Aiko Narazaki, Dai Yashitomi, Hideyuki Takada
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Proceedings Volume PC12408, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII; PC1240809 (2023) https://doi.org/10.1117/12.2648299
Event: SPIE LASE, 2023, San Francisco, California, United States
Abstract
Recently, we started a new project toward data-driven laser processing, in which real-time monitoring data are delivered to AI system for high-speed optimization. Then, the optimized laser parameters are transferred to the ultrafast laser processing system. To follow the optimized parameters instantly, it’s important to develop a new laser processing system with high-speed modulation as well as wide-range variable parameters. In this work, effect of ultrafast laser parameters including high-speed modulation on ablation volume was discussed for micro-drilling of glass materials. The drilling of silica glass was performed under three types of modulation conditions with the same total input power and number of pulses: monotonic increase in the pulse energy, constant energy, monotonic decrease. As a result, the holes drilled with monotonic decrease became much deeper compared to samples drilled under monotonic increase. The usefulness of the high-speed laser modulation was demonstrated.
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Aiko Narazaki, Dai Yashitomi, and Hideyuki Takada "Laser micro-drilling of glass materials with high-speed laser modulation and real-time monitoring toward data-driven laser processing", Proc. SPIE PC12408, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII, PC1240809 (17 March 2023); https://doi.org/10.1117/12.2648299
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KEYWORDS
Laser processing
Modulation
Glasses
Laser glasses
Laser systems engineering
Ultrafast lasers
Laser development
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